Supporting highly integrated or small-sized chips and modules, such as PA, SIP packaging, etc; Adapt to different chip scenarios and improve performance requirements through design optimization.

Related Product Series:

Multilayer Ceramic Chip Capacitors for general use (C Series)

High-Q, High-Frequency Multilayer Ceramic Chip Capacitors (U series)

Industrial Grade Medium-High voltage Multilayer Ceramic Chip Capacitors (B series)

Features of C series products:

1) The mainstream packaging sizes are ultra micro sizes such as 01005 (0.4*0.2mm) and 008004 (0.25*0.125mm), which meet the trend of market miniaturization and high integration, and reduce the loop impedance of peripheral circuits

2) Further thinning: The 01005 series thin profile has a maximum thickness of only 0.11-0.15mm; the 0201 series thin profile has a maximum thickness of only 0.11-0.22mm

Typical specifications of C series:

008004-C0G-0.5pF-±0.1pF-16V

008004-X5R-22nF-±5%-4V

01005-C0G-33pF-±5%-25V

01005-X7R-1nF-±10%-25V

Typical specifications for low profile:

01005-C0G-0.2pF-±0.1pF-25V-Tmax 0.11mm

01005-X5R-0.1μF-±20%-4V- Tmax 0.15mm

0201-X5R-0.1μF-±20%-6.3V- Tmax 0.11mm

0201-X5R-1μF-±20%-6.3V- Tmax 0.22mm

Features of the U series products:

1) Can effectively improve the signal transmission efficiency of RF circuits, reduce reflection losses, and enhance processing capabilities

2) Further thinning helps PA chips improve space utilization: 01005 series thin version, with a maximum thickness of only 0.11-0.15mm

Typical specifications of the U series:

01005-Hi Q-C0G-0.5pF-±2%-25V

01005-Hi Q-C0G-10pF-±2%-25V

01005-Hi Q-C0G-0.5pF-±0.1pF-25V- Tmax 0.11mm

01005-Hi Q-C0G-2.7pF-±0.1pF-25V- Tmax 0.11mm

Features of B series products:

1) Chip scene requirements that meet higher reliability requirements

2) Special plating and design meet special chip scenarios, such as copper terminals for ECP/PSIP PCB embedded chip applications, 0204 length and width inversion to meet various pad design space placement requirements, further improving chip performance

Typical specifications of B series:

0201-X7R-10nF-±10%-25V-Tmax 0.33mm-Copper plated terminal

0402-X7R-100nF-±10%-25V-Tmax 0.33mm-Copper plated terminal

0204-X7T-470nF-±10%-4V-Tmax 0.22mm-Inverted length and width

0204-X7T-1μF-±20%-2.5V-Tmax 0.35mm-Inverted length and width